Contact

 

LOCATION SCHWEIZ
Wagner AG,
Metalldruckguss, Thermoplastspritzguss und Werkzeugbau
Urnäscherstrasse 22
9104 Waldstatt / AR

+ 41 71 354 8181
info@wagner-solution.com

 

LOCATION BOSNIA
Wagner Automotiv d.o.o.
Sarajevska 62
76250 Gradacac
Bosnia und Herzegovina

+ 387 35 816 737
info@wagner-automotiv.ba

News

New Product Development

Up to 50% weight- and cost-reduction with electromagnetic-shielding hybrid- and plastic housings.

Wagner successfully concluded a highly innovative research and development program. As part of a state-funded Innosuisse R&D-Project, Wagner developed a light-weight solution for electronic housings and heatsinks. The multi-year project was made in collaboration with the Institute of Polymer Engineering and the Institute of Electrical Engineering of the University of Applied Sciences Northwestern Switzerland. Based on the vast process know-how and multi-material competence of Wagner, electronic housings can now be produced based on pure EMI-shielding thermoplastic polymers or a metal-polymer hybrid solution. The solution ensures that electromagnetic shielding and heat transmission performance requirements can be fulfilled at least on the same level as the traditional aluminum die casting option. At the same time, a significant reduction in cost and weight of up to 50% can be achieved, defining a new performance dimension especially in the automotive, aerospace and machinery industry. Thanks to the development of a proprietary 3D-measurement method and a 3D Simulation tool, Wagner can model the electromagnetic absorption already in the product development stage and thus cut down development time and costs for its customers significantly.

Our engineering-team is happy to support the development of your own solution, based on your specific geometric and performance-related requirements.

Exhibit:

Electronic housings in aluminum die casting; metal-plastic hybrid solution with integrated heat-sink and pure polymer solution with EMI shielding.

3-D EMI-measurement of the polymer-based electronic housing